Duplicate from Mobiusi/PCB-Solder-Joint-Defect-Detection-Dataset

Co-authored-by: Mobiusi Data Technology <Mobiusi@users.noreply.huggingface.co>

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+*tfevents* filter=lfs diff=lfs merge=lfs -text
+# Audio files - uncompressed
+*.pcm filter=lfs diff=lfs merge=lfs -text
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+# Audio files - compressed
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183c3b9bafe220ae611946f6e115ff19.json

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+{"file_name":"183c3b9bafe220ae611946f6e115ff19.png","quality":"1500*1235","pcb_id":"Not provided","defect_type":"Excess soldering or burn","defect_size":"About 5 mm","defect_severity":"Severe","component_type":"Unknown","inspection_result":"Fail","image_quality":"Clear","lighting_condition":"Good","pcb_orientation":"Horizontal"}

5a12d0a769ffb5091998837628030149.json

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+{"file_name":"5a12d0a769ffb5091998837628030149.png","quality":"1500*1625","pcb_id":"Temporarily unrecognized","defect_type":"Possible cold solder","defect_size":"About 1 mm","defect_severity":"Moderate","component_type":"Through-hole electronic component","inspection_result":"Fail","image_quality":"Clear","lighting_condition":"Good natural light","pcb_orientation":"About 45 degrees"}

64a956d5b242f819af1e64d7237c6089.json

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+{"file_name":"64a956d5b242f819af1e64d7237c6089.png","quality":"1500*1782","pcb_id":"7715041A_Y1_240","defect_type":"Unknown","defect_size":"Unknown","defect_severity":"Unknown","component_type":"USB port","inspection_result":"Unknown","image_quality":"Clear","lighting_condition":"Good","pcb_orientation":"0 degrees"}

README.md

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+---
+tags:
+- Image Classification
+- Object Detection
+- Defect Inspection
+- Quality Control
+- Manufacturing
+license: cc-by-nc-sa-4.0
+task_categories:
+- image-classification
+language:
+- en
+pretty_name: PCB Solder Joint Defect Detection Dataset
+size_categories:
+- 1B<n<10B
+---
+
+# PCB Solder Joint Defect Detection Dataset
+
+The PCB manufacturing industry is facing challenges in maintaining high-quality standards, particularly in the detection of solder joint defects post-wave and reflow soldering. Existing solutions often rely on manual inspection or less efficient automated systems that are prone to errors. This dataset aims to address the specific technical challenge of accurately identifying and classifying defects in solder joints, fulfilling the business requirement of enhancing inspection efficiency and reliability. The dataset consists of images collected using high-resolution cameras in controlled lighting environments, ensuring clear visibility of defects. Quality control measures include multi-round annotations, consistency checks among annotators, and expert reviews to ensure high accuracy. The data is organized in JPG format, with each image labeled according to its defect type and location.
+
+## Technical Specifications
+
+| Field | Type | Description |
+| :---  | :---  | :--- |
+| file_name | string | File name |
+| quality | string | Resolution |
+| pcb_id | string | A unique identifier used to distinguish different PCBs. |
+| defect_type | string | The type of defect in the solder joint, such as short circuit, cold solder joint, etc. |
+| defect_size | float | The actual size of the solder joint defect, measured in millimeters. |
+| defect_severity | string | The severity rating of the defect, such as minor, moderate, severe. |
+| component_type | string | The type of electronic component where the solder joint is located. |
+| inspection_result | string | The result of the inspection of the solder joint, such as pass or fail. |
+| image_quality | string | The quality assessment of the image, such as clear or blurred. |
+| lighting_condition | string | Description of the lighting conditions or environment during image capture. |
+| pcb_orientation | string | Description of the orientation of the PCB in the image, such as 0 degrees, 90 degrees. |
+
+## Compliance Statement
+
+<table>
+  <tr>
+    <td>Authorization Type</td>
+    <td>CC-BY-NC-SA 4.0 (Attribution–NonCommercial–ShareAlike)</td>
+  </tr>
+  <tr>
+    <td>Commercial Use</td>
+    <td>Requires exclusive subscription or authorization contract (monthly or per-invocation charging)</td>
+  </tr>
+  <tr>
+    <td>Privacy and Anonymization</td>
+    <td>No PII, no real company names, simulated scenarios follow industry standards</td>
+  </tr>
+  <tr>
+    <td>Compliance System</td>
+    <td>Compliant with China's Data Security Law / EU GDPR / supports enterprise data access logs</td>
+  </tr>
+</table>
+
+## Source & Contact
+
+If you need more dataset details, please visit [Mobiusi](https://www.mobiusi.com/datasets/a9087da4a47f082d8897971974b42f83?utm_source=huggingface&utm_medium=referral). or contact us via contact@mobiusi.com

b069fd44a5e456f8fd0dc2e5d6af0fa2.json

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+{"file_name":"b069fd44a5e456f8fd0dc2e5d6af0fa2.png","quality":"1500*1087","pcb_id":"R39","defect_type":"Crack","defect_size":"Approximately 0.5 mm","defect_severity":"Moderate","component_type":"Resistor","inspection_result":"Failed","image_quality":"Clear","lighting_condition":"Good","pcb_orientation":"0 degree"}

ec98edd41c3a785e30287a871d5e67a2.json

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+{"file_name":"ec98edd41c3a785e30287a871d5e67a2.png","quality":"1500*1768","pcb_id":"Not provided","defect_type":"Burn mark","defect_size":"About 5 mm","defect_severity":"Severe","component_type":"Connector","inspection_result":"Fail","image_quality":"Clear","lighting_condition":"Good lighting","pcb_orientation":"About 45 degrees"}